Joining materials
Introducing Pb-free solder paste, BGA balls, and flux.
We would like to introduce the "joining materials" handled by Dai Nichi Shoji Co., Ltd. The "Pb-free solder paste" comes in two types: water-washable and no-clean, with the viscosity of the water-washable type being 160 Pa.s and the no-clean type being 180 Pa.s. The "BGA balls" are available in two types: low melting point and high melting point, and we offer three types of "flux" with different viscosities. 【Main compositions (Pb-free solder paste)】 ■Sn-Ag-Cu ■Sn-Zn-Al(Bi) ■Sn-Ag-Cu-Co ■High melting point options are also available *For more details, please refer to the PDF materials or feel free to contact us.
- Company：大日商事
- Price：Other
